Lead-Free Solder Interconnect Reliability

Soldering & Surface Mount Technology

ISSN: 0954-0911

Article publication date: 1 June 2005

185

Keywords

Citation

(2005), "Lead-Free Solder Interconnect Reliability", Soldering & Surface Mount Technology, Vol. 17 No. 2. https://doi.org/10.1108/ssmt.2005.21917bae.005

Publisher

:

Emerald Group Publishing Limited

Copyright © 2005, Emerald Group Publishing Limited


Lead-Free Solder Interconnect Reliability

Lead-Free Solder Interconnect Reliability

Dongkai ShangguanASM International PublicationApproximately 350 pagesScheduled to publish Summer/Fall 2005available at: www.asminternational.org

Keywords: Solder, Product reliability, Books

This book provides the most uptodate knowledge and data available on the reliability of lead-free solder interconnects. The content has been written by leading experts working in this important technology area. Both fundamental research and practical considerations are addressed (Plate 1).

Environmental regulations are driving the worldwide adoption of lead-free soldering technology for electronics packaging, board assembly, and related manufacturing operations. While a significant amount of research and development work has been conducted in recent years on manufacturing issues to enable the conversion to lead-free solders, data from studies related to the reliability of lead-free solder interconnects are still emerging.

Plate 1 The content has been written by leading experts

Many research projects around the world have been undertaken to study lead-free solder reliability under different loading conditions. The results of these studies have been reported rather sporadically at various technical conferences. This is the first book dedicated specifically to this topic, which is of paramount importance to the electronics industry. The coverage is focused primarily on tin-silver-copper and tin-copper eutectic (or near eutectic alloys) – the primary lead-free solder alloys being adopted by the worldwide electronics industry.

This volume will be of particular interest to practitioners in the electronics industry, who need to understand the reliability of solder interconnects for design, testing, quality assurance, and failure analysis. It also will be of great value to industry and academic researchers, educators, and students.

About the contributors

An “all star” team of internationally renowned experts, with in-depth knowledge in the many important areas of lead-free solder interconnect reliability, have contributed chapters to the book. Contributors represent the US and international government research facilities, universities, and industrial companies. The editor is Dongkai Shangguan, who has been working on lead-free solder technology since 1991, first at Ford Motor Company and Visteon Corporation and now at Flextronics International. Dr Shangguan has published over 100 papers and has been awarded a number of patents to date on lead-free solders and environmental technology. In 2002 he won the “Soldertec Lead-Free Soldering Award” in recognition of his long-term involvement in lead-free research, implementation, and industry leadership.

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