ssmt10.1108/ssmtSoldering & Surface Mount Technology0954-0911Emerald Group Publishing Limited10.1108/ssmt.2005.21917aad.009e-non-articleSecondary articleNew productscat-ENGGEngineeringcat-EEEElectrical & electronic engineeringHenkel's Multicore® MP218 solder paste formulation delivers robust performance across a wide range of process conditions01032005171© Emerald Group Publishing Limited2005Solder paste.peer-reviewednoacademic-contentyesrightslinkexcludedHenkel's Multicore® MP218 solder paste formulation delivers robust performance across a wide range of process conditions

Henkel's Multicore® MP218 solder pasteformulation delivers robust performance across a wide range of processconditions

Keywords: Solder paste

The electronics group from Henkel has launched a new solder paste, Multicore™MP218. A halide-free, no-clean formulation, MP218 is pin-testable and offersbroad process windows for both printing and reflow. Significantly, it alsoexhibits very high resistance to humidity, a particular advantage formultinational manufacturers wishing to qualify a single solder paste that willperform dependably within assembly environments ranging from arid to humidaround the globe (Plate 3).

Plate 3Henkel's Multicore® MP218 solder paste

Even after 24 h at 75 percent relative humidity, Multicore MP218 achieves aconsistently high degree of coalescence upon reflow, and in independent testingto IPC ANSI/J-STD-005 and JIS-Z- 3284 standards displays superior slumpresistance to its leading competitor. During printing and assembly, the benefitsof specifying MP218 are low paste wastage – the result of superior tacklife and an open time of more than 24 h – and resistance to componentmovement during high-speed placement, due to its high initial tack force,measured at 1.6 g/mm2.

Multicore MP218 is suitable for reflow in air or nitrogen, giving excellentsolderability on a wide range of surface finishes. Post-reflow, the solder pasteleaves colourless residues to ease visual inspection. Being of soft, non-stickconsistency, the residues also permit reliable in-circuit testing withoutclogging test probes, even after being subjected to double reflow and manyhundreds of tests.

Multicore MP218 is initially available in Sn62 and Sn63 alloys, and 63S4alloy where anti-tombstoning properties are desirable. A lead-free version ofthe solder paste offering similar process advantages is under development anddue to be released shortly.

For further information visit the web site: www.henkel.com/electronics