Quadris™ from Universal Instruments delivers concentrated high volume placement

Soldering & Surface Mount Technology

ISSN: 0954-0911

Article publication date: 1 December 2004

Citation

(2004), "Quadris™ from Universal Instruments delivers concentrated high volume placement", Soldering & Surface Mount Technology, Vol. 16 No. 3. https://doi.org/10.1108/ssmt.2004.21916cad.012

Publisher

:

Emerald Group Publishing Limited

Copyright © 2004, Emerald Group Publishing Limited


Quadris™ from Universal Instruments delivers concentrated high volume placement

Quadris™ from Universal Instruments delivers concentrated high volume placement

Universal Instruments is bolstering its high speed chip placement offering with the introduction of the Quadris™ placement machine (Plate 3). This quad-beam solution complements Universal’s existing portfolio consisting of the dual-beam Genesis and single-beam AdVantis™ platforms configured with Lightning™ heads, and the traditional turret-style HSP to address the high-speed, high-volume chip placement market. Quadris achieves 62,000 cph placement speed within a small footprint that sets the performance standard for concentrated throughput in a four-gantry system. With the addition of Quadris, Universal offers its most comprehensive range of chip placement solutions, addressing virtually any market requirement.

Plate 3 Quadris™ is a combination of turret and overhead gantry formats for high volume placement

For further information visit our Web site: www.uic.com