TY  - JOUR
AB  - 
VL  - 16
IS  - 3
SN  - 0954-0911
DO  - 10.1108/ssmt.2004.21916cad.010
UR  - https://doi.org/10.1108/ssmt.2004.21916cad.010
PY  - 2004
Y1  - 2004/01/01
TI  - DuPont Electronic Technologies introduces WB dry photoresist for semiconductor wafer bumping at Semicon Europe
T2  - Soldering & Surface Mount Technology
PB  - Emerald Group Publishing Limited
Y2  - 2024/04/18
ER  -