TY  - JOUR
AB  - 
VL  - 16
IS  - 3
SN  - 0954-0911
DO  - 10.1108/ssmt.2004.21916cad.006
UR  - https://doi.org/10.1108/ssmt.2004.21916cad.006
PY  - 2004
Y1  - 2004/01/01
TI  - Water-soluble solder paste cuts out waste
T2  - Soldering & Surface Mount Technology
PB  - Emerald Group Publishing Limited
Y2  - 2024/09/23
ER  -