SMT/HYBRID/PACKAGING 2004 a huge success

Soldering & Surface Mount Technology

ISSN: 0954-0911

Article publication date: 1 December 2004

Keywords

Citation

(2004), "SMT/HYBRID/PACKAGING 2004 a huge success", Soldering & Surface Mount Technology, Vol. 16 No. 3. https://doi.org/10.1108/ssmt.2004.21916cac.003

Publisher

:

Emerald Group Publishing Limited

Copyright © 2004, Emerald Group Publishing Limited


SMT/HYBRID/PACKAGING 2004 a huge success

SMT/HYBRID/PACKAGING 2004 a huge success

Keywords: SMT, Microelectronics, Packaging, Conferences

SMT/HYBRID/PACKAGING, Europe’s No. 1 event on System Integration in Micro Electronics, closed its doors after three outstandingly successful days.

The main figures in short: 651 exhibitors (2003: 626), among them 34 per cent or 218 companies from abroad, presented a broad spectrum of the latest in System Integration in Micro Electronics on a total of 25,790 sqm floor space (2003: 24,750 sqm).

23,414 trade visitors (2003: 22,849) came to see the show, thus exceeding the already high level of attraction realised last year. The present upswing within the electronics industry was clearly reflected at the show: the atmosphere was extremely positive and the exhibitors were deeply satisfied with the number and quality of their contacts. At times the rush was so heavy that the respective booth staff could hardly cope with so many visitors at a time. This is mainly due to the fact that compared to last year many visitors spent more time in.

Nuremberg – many two instead of one day, and some even the whole three. In addition, there were many more visitors from Italy, Scandinavia and Eastern Europe than ever before.

The next edition of SMT/HYBRID/PACKAGING 2005 will be held in Nuremberg, 19-21 April 2005.

For more information, visit www.mesago.de