Soldertec Global requests nominations for 2004 Lead-free Solder Awards

Citation

(2004), "Soldertec Global requests nominations for 2004 Lead-free Solder Awards", Soldering & Surface Mount Technology, Vol. 16 No. 3. https://doi.org/10.1108/ssmt.2004.21916cab.006

Soldertec Global requests nominations for 2004 Lead-free Solder Awards

Soldertec Global requests nominations for 2004 Lead-free Solder Awards

Keywords: Lead-free soldering, Awards

Soldertec Global is offering individuals or organisations involved with the development of lead-free technology the opportunity to apply for one of this year’s Lead-free Solder Awards. The awards recognise significant contributions, which researchers, engineers or companies have made to the development and implementation of lead-free electronics soldering during 2004. Applications can be made directly by individuals or organisations, but industry is also encouraged to provide nominations of individuals they feel should be recognised through this award.

Applications or nominations should be made by email to tom.perrett@tintechnology.com describing in less than 300 words the work of the individual towards achieving the successful introduction of lead-free electronics. The deadline for application is 15 October 2004 and winners will be announced in November 2004.

Past awards have been made for leading collaborative research projects, introducing lead-free soldering into production, making particular improvements in process technology or contributing to knowledge through academic studies. Details of previous award winners can be found below.

The Soldertec award was established in 1999 to mark the launch of Tin Technology’s Lead-free Soldering Centre (Soldertec Global) and was granted in its first year to Dr Kenichiro Suetsugu of Panasonic, in Japan, in recognition of the successful introduction of lead-free soldering in mass production of the portable MiniDisc SJ-MJ30-S.

More information is available from the Soldertec Global Web site: www.lead-free.org