The 6th International Conference on Electronics Materials and Packaging (EMAP 2004)

Soldering & Surface Mount Technology

ISSN: 0954-0911

Article publication date: 1 December 2004



(2004), "The 6th International Conference on Electronics Materials and Packaging (EMAP 2004)", Soldering & Surface Mount Technology, Vol. 16 No. 3.



Emerald Group Publishing Limited

Copyright © 2004, Emerald Group Publishing Limited

The 6th International Conference on Electronics Materials and Packaging (EMAP 2004)

The 6th International Conference on Electronics Materials and Packaging (EMAP 2004)

5-7 December 2004The Bayview Beach Resort, Batu Feringghi, Penang, Malaysia

About EMAP

The 6th Electronics Material and Packaging Conference (EMAP 2004) is an international event organized by the School of Mechanical Engineering, Universiti Sains Malaysia, and IEEE CPMT Chapter with joint technical co-sponsorship from CPMT society of IEEE.

EMAP 2004 will feature short courses, technical sessions, and exhibition. It aims to provide good coverage of developments in all areas of electronic materials and packaging, from design to manufacturing and operation. EMAP 2004 is a major forum, providing opportunities to network and meet leading experts in addition to exchange of up to date knowledge in the field. Since 1999, EMAP has gained a reputation as a premier electronic materials and packaging conference in Asia Pacific where the bulk of the packaging activities are taking place.

Conference topics

The topics of interests are specific to micro systems/MEMS, their packaging, electronics materials and reliability issues. Extended abstracts are being sought from, but not limited to, the following areas:

  • Automotive electronics

  • Chip-scale packaging/flip chip

  • Electrical modeling and signal integrity

  • Green materials

  • High density displays

  • High density packaging

  • Interconnection technologies

  • Low cost packaging methods

  • Manufacturing technologies

  • Mechanical modeling and structural integrity

  • MEMS packaging and applications

  • Microelectronic materials and processes

  • No flow underfilling process

  • Optoelectronics/photonics

  • Polymer materials and microelectronic applications

  • Printed wiring and flex boards

  • Quality and reliability

  • Thermal design, analysis, and characterization

  • Electronic inspection

  • Thick and thin film materials

  • Wafer scale packaging

  • Wireless sensor packaging and applications

  • Vibration on electronic devices

Some important dates are just listed as follows:

  • Submission of abstract: 30 June 2004 (Revised).

  • Notification of acceptance: 15 July 2004.

  • Submission of manuscript: 31 August 2004.

Extended abstract and paper submission

Extended abstracts are invited to describe original and unpublished work. The extended abstract should be about 500 words stating clearly the purpose, methodology, results, and conclusions of the work. Key references to prior publications and how the work enhances the existing knowledge should be included in the extended abstract. Authors are requested to designate appropriate areas for the purpose of abstract review. All submissions must be in English and should be made via electronic mail to The required file format is either MS Word or Adobe Acrobat© PDF with only one single file for each submission.

The abstracts must be received by 30 June 2004. Authors are requested to include their affiliation, mailing address, telephone and fax numbers, and e-mail address. Authors will be notified of paper acceptance and instruction for preparing final papers by 15 July 2004. The final manuscript for publication in the conference proceedings is due by 31 August 2004.

Short courses:

The conference program includes short courses, which will be conducted by leading experts in the field. Details will be provided in the conference Web site and available in subsequent mailings.


A tabletop exhibition from suppliers of materials, equipment, components, software, and service providers of electronic industries will be held at the venue of the conference

Conference Information and Contacts:

General ChairZaidi Mohd RipinTel:+60-4-593-7788 (ext: 6300); Fax:+60-4-594-1025;

Technical Program Chairs

K. N. SeetharamuTel:+60-4-593-7788 (ext: 6309); Fax:+60-4-594-1025; E-mail:

Mr Teck Joo GohTel:+60-4-253-1236; Fax:+60-4-253-1028; E-mail:


School of Mechanical Engineering, Engineering Campus, Universiti Sains Malaysia, 14300 Nibong Tebal, Seberang Perai Selatan, Pulau Pinang. Tel:+60-4-593 7788 (ext. 6301); Fax:+60-4-594 1025; E-mail:

For further information visit our Web site:

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