Lead-free soldering

Soldering & Surface Mount Technology

ISSN: 0954-0911

Article publication date: 1 August 2004

Keywords

Citation

(2004), "Lead-free soldering", Soldering & Surface Mount Technology, Vol. 16 No. 2. https://doi.org/10.1108/ssmt.2004.21916bad.023

Publisher

:

Emerald Group Publishing Limited

Copyright © 2004, Emerald Group Publishing Limited


Lead-free soldering

Lead-free soldering

Keywords: Lead-free soldering books

How will the European Directive banning the use of lead in electronic and electrical equipment impact your business?

Have you the knowledge and information you need to meet the regulations?

Do you know how to go about it, when you need to be lead-free and when you need to start preparing?

Would you like some simple and straightfoward help?

"A guide to lead-free soldering for assemblers and sub-contractors", written by Roger Bilham, a metallurgist with many years' experience developing and making solder products, is a concise source of the information you need.

Topics covered in its 48 pages include the following.

  • Legal position in Europe, USA and Japan.

  • Lead-free alloy requirements – technical and economic.

  • Problems posed by lead-free solders.

  • Melting temperatures.

  • Oxidation and corrosion.

  • Fillet lifting and cracking

  • Tombstoning.

  • Tin whiskers

  • Tin pest.

  • Potential and practical lead-free alloys with their properties.

  • High temperature, high lead solder – component internal connections, non-melting columns and balls, module assembly.

  • Patents.

  • Lead-free circuit board finishes.

  • Lead-free hot air solder levelling.

  • Components for lead-free soldering – temperature capabilities and terminations.

  • Fluxes

  • Mixed lead-free and lead-containing solders and finishes.

  • Lead-free process challenges – cost, temperature, process window, machine issues, flux residues.

  • Defects, inspection and quality.

  • Repair and rework.

  • Solder variety and standardisation.

  • Use of nitrogen.

  • Lead-free in the reflow process – temperature profile, machine implications.

  • Lead-free in the wave process – composition changes, machine implications.

  • Lead-free vapour phase soldering.

  • Environmental and cost disadvantages of lead- free solders.

  • Logistics of introducing lead-free solders.

  • Sources of further information.

A Guide to Lead-Free Soldering is available, priced £35.00, as a PDF file by E-mail or on a CD from Roger Bilham. E-mail: rbc@bilham.co.uk