McDry prevents micro-cracking in ICs

Soldering & Surface Mount Technology

ISSN: 0954-0911

Article publication date: 1 August 2004




(2004), "McDry prevents micro-cracking in ICs", Soldering & Surface Mount Technology, Vol. 16 No. 2.



Emerald Group Publishing Limited

Copyright © 2004, Emerald Group Publishing Limited

McDry prevents micro-cracking in ICs

McDry prevents micro-cracking in ICs

Keywords: Reflow, Corrosion, Printed circuit boards

McDry, a new range of drying-cabinets developed by Seika Sangyo GmbH are available exclusively in the UK and Ireland from Contax, the UK's leading independent supplier of automated production machines.

Virtually 100 percent of IC packages containing moisture have a problem with micro-cracking during the Reflow process. This results in the corrosion of printed circuits and can cause wiring breakage and many other problems. This can be prevented by storing and dehumidifying ICs using the new McDry cabinet.

Available in a wide range of sizes, McDry offers ultra low humidity storage of sensitive surface mount devices as specified by "Standard for Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices", IPC/JEDEC J-STD-033a (July 2002). Storing the ICs in McDry completely eliminates the risk of micro-cracking and can be used as an alternative to baking.

The cabinets are nitrogen-free, instead relying on a powerful zeolite desiccant which is automatically recycled and does not need replacement. Using McDry, ICs can be stored safely both before and after mounting, so ensuring complete product integrity.

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