TY  - JOUR
AB  - 
VL  - 16
IS  - 2
SN  - 0954-0911
DO  - 10.1108/ssmt.2004.21916bad.002
UR  - https://doi.org/10.1108/ssmt.2004.21916bad.002
PY  - 2004
Y1  - 2004/01/01
TI  - New DYMAX electronics encapsulant is ultra-flexible
T2  - Soldering & Surface Mount Technology
PB  - Emerald Group Publishing Limited
Y2  - 2024/04/25
ER  -