New lead-free solder pastes from Agmet

Soldering & Surface Mount Technology

ISSN: 0954-0911

Article publication date: 1 August 2004

Keywords

Citation

(2004), "New lead-free solder pastes from Agmet", Soldering & Surface Mount Technology, Vol. 16 No. 2. https://doi.org/10.1108/ssmt.2004.21916bad.001

Publisher

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Emerald Group Publishing Limited

Copyright © 2004, Emerald Group Publishing Limited


New lead-free solder pastes from Agmet

New lead-free solder pastes from Agmet

Keywords: Lead-free soldering, Solder paste

Agmet Limited, based in Reading, Berkshire, and part of the ESL Group, have just introduced a new range of lead-free solder pastes under the EnviroFlo™ label. This is a Sn/Sa/Cu alloy with a 217°C eutectic. It is compatible with most of the commercially available coatings to be found on both components and PCBs. These include ENIG, OSP, Bare Cu, PD/NI and conventional Sn/PB coatings.

For further information, visit the Web site: www.solderpaste.co.uk