Universal and DaimlerChryslerSIM Tech. announce joint investment and technology partnership

Soldering & Surface Mount Technology

ISSN: 0954-0911

Article publication date: 1 August 2004

Citation

(2004), "Universal and DaimlerChryslerSIM Tech. announce joint investment and technology partnership", Soldering & Surface Mount Technology, Vol. 16 No. 2. https://doi.org/10.1108/ssmt.2004.21916bab.026

Publisher

:

Emerald Group Publishing Limited

Copyright © 2004, Emerald Group Publishing Limited


Universal and DaimlerChryslerSIM Tech. announce joint investment and technology partnership

Universal and DaimlerChryslerSIM Tech. announce joint investment and technology partnership

Universal Instruments has further underlined its commitment to China's high technology base by establishing requisites for a long-term partnership with DaimlerChryslerSIM Technology (JV between DaimlerChrysler and Shanghai Institute of Microsystem and Information Technology, DCSIM Tech.) located in Shanghai, China.

The objective is to build local expertise in advanced electronic packaging. The two companies will invest in China's future in these technologies by training engineers, working with local suppliers, increasing local infrastructure and supporting local company projects for first and second level packaging.

"Our vision is to build an industry capable of servicing local Chinese component manufacturers and assemblers as well as export markets throughout Asia and world-wide," said Richard Boulanger of Universal Instruments' SMT Laboratory. "Both businesses will invest substantial resources to nurture local technical expertise and enhance the local infrastructure in Shanghai and Suzhou."

For DCSIM Tech., Dr Xiaoming Xie said, "Both companies are well positioned to develop China's high-tech electronics industry. As one of the major players on the local market for many years, I am pleased that this agreement has established long term objectives, as a high level of ongoing commitment is the only truly effective way to establish China as a global center of excellence".

Under the draft terms, Universal Instruments, which has assembly process expertise and laboratories in Binghamton, NY, USA and Suzhou, China, will also help sponsor a student from DCSIM Tech. to join the Electronics Packaging program at Binghamton University. DCSIM Tech. will offer students and other resources such as failure analysis and reliability testing for specific Universal projects.

For further information, visit the Web site: www.uic.com