Universal Instruments and CyberOptics sign partnership agreement

Soldering & Surface Mount Technology

ISSN: 0954-0911

Article publication date: 1 August 2004

Citation

(2004), "Universal Instruments and CyberOptics sign partnership agreement", Soldering & Surface Mount Technology, Vol. 16 No. 2. https://doi.org/10.1108/ssmt.2004.21916bab.022

Publisher

:

Emerald Group Publishing Limited

Copyright © 2004, Emerald Group Publishing Limited


Universal Instruments and CyberOptics sign partnership agreement

Universal Instruments and CyberOptics sign partnership agreement

Universal Instruments Corporation and CyberOptics Corporation have signed an agreement to integrate the new Embedded Process Verification (EPVe) inspection technology from CyberOptics into Universal's latest-generation electronic component placement systems.

Universal will offer the CyberOptics EPV sensor system as a feature on its recently released Genesise and AdVantise platform placement machines that incorporate its new Lightninge placement head. Introduction of the EPV sensor is currently planned for the second half of 2004.

"EPV is one of the most exciting innovations in this industry in recent times," stated Ian McEvoy, president of Universal Instruments Corporation. "To achieve the challenging quality goal of less than ten defects per million for SMT circuit board assembly, you have to verify each component placement. The CyberOptics' EPV is the first sensing system to enable this within the placement machine." Universal demonstrated an EPV prototype at the Productronica Trade Show in Munich, Germany in November 2003, and both companies demonstrated the product at IPC's annual APEX Trade Show in Anaheim, CA in February this year.