Henkel Technologies enhances its Multicore® technical support team with M.O.L.E.® Technology</B>

Soldering & Surface Mount Technology

ISSN: 0954-0911

Article publication date: 1 August 2004



(2004), "Henkel Technologies enhances its Multicore® technical support team with M.O.L.E.® Technology</B>", Soldering & Surface Mount Technology, Vol. 16 No. 2. https://doi.org/10.1108/ssmt.2004.21916bab.016



Emerald Group Publishing Limited

Copyright © 2004, Emerald Group Publishing Limited

Henkel Technologies enhances its Multicore® technical support team with M.O.L.E.® Technology</B>

Henkel Technologies enhances its Multicore® technical support team with M.O.L.E.®

Henkel Technologies has selected ECD's SuperM.O.L.E.® Gold system to help raise the level of technical support it can provide to customers for its Multicore® solder products throughout Europe and to establish a standard platform. After a rigorous test and evaluation procedure, involving five competing products, Henkel Technologies decided that ECD's market leading temperature-profiling tool offered the best combination of features, software, simplicity of use and technical support.

Henkel Technologies wanted a profiling tool that its engineers could use to help set-up new soldering processes and troubleshoot any soldering-related problems at the sites of its Multicore® customers. The SuperM.O.L.E.® Gold meets this need as it can be used to optimise process parameters, reduce rework and scrap, lower set-up times, compare temperature profiles and maintain processes in control by using SPC software.

ECD's SuperM.O.L.E.® Gold is a six-channel thermal profiler and is delivered along with all the necessary equipment to enable the user to quickly start his profiling operation. A thermal barrier, capable of protecting the unit in even the harshest lead-free environment, software, manuals and a selection of colour coded thermocouples are included in the kit.

Specially developed SuperM.O.L.E.® for Windowse software takes the time and temperature information from the M.O.L.E.® and displays it on the computer screen, allowing all, or some, of the thermocouple data to be viewed simultaneously. The software can show temperatures at any point in the soldering process, as well as the change in degrees per second, how long the object has spent above specific temperatures, average temperatures, standard deviations and more.

Additional online support is available via ECD's Web site (www.ecd.com), which includes software downloads, upgrades and free licensing for customers. The software downloads include paste specifications for Multicore® and other manufacturers products and a comprehensive oven library. For example, the ProfilePlanner tool matches ovens to pastes and generates the most robust profile for the selection. The tool is continually updated and covers over 300 pastes, with specifications for the ramp, soak and spike values, as well as the time above liquidous.

The SuperM.O.L.E.® Gold offers six-channel measurement over a temperature range from −129 to +1,300°C (−200 to +2372°F), to an accuracy within 18C (1.8°F) and a resolution of 0.5°C (1°F). The sampling interval can be set from 0.2 s up to 24 h, and up to 5,460 samples can be recorded with six channels active. The compact unit measures 89 × 152.4 × 9.41 mm (3.5 × 6.0 × 0.38 in.) and it is supplied with a rechargeable Ni-MH power pack.

For more information, visit the Web site: www.ecd.com

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