Soldering & Surface Mount Technology

ISSN: 0954-0911

Article publication date: 1 August 2004




(2004), "SMT/HYBRID/PACKAGING 2004", Soldering & Surface Mount Technology, Vol. 16 No. 2.



Emerald Group Publishing Limited

Copyright © 2004, Emerald Group Publishing Limited



System Integration in Microelectronics

International Trade Show and Conference, 15-17 June 2004, Nuremberg Conference Centre

Keywords: Conferences, Germany, SMT

All kinds of solutions, products and services associated with system integration in microelectronics will be on show at the SMT/HYBRID/ PACKAGING 2004, which will take place from 15 to 17 June 2004 in Nuremberg. The exhibition will provide a comprehensive overview of the sector from design and development, PCB production, component parts, placement technologies, through to testing equipment and the latest placement processes – all under one roof.

By February 2004, in comparison to SMT/ HYBRID/PACKAGING 2003, the exhibition space is already noticably greater. This clearly shows the development of the event: rise in number of national and international exhibitors, much larger stand spaces booked by some exhibitors and a growing confidence in the sector's future growth. From newcomers to the market leaders, the sector has passed a vote of confidence in the SMT/HYBRID/PACKAGING, with the date firmly fixed in the exhibition calendar.

This year's VDI/VDE production line will demonstrate "The PCB as platform for integrating component production" with a focus on PCB miniaturisation and associated technologies. A modern production line will manufacture components offering various possibilities for integration – from discrete components and embedded components to SoC and SiP solutions. Some of the future trends for producing electronic components will be presented at several production and demonstration areas next to the main production line.

For the first time, Germany's PCB Association will be taking part at the SMT/HYBRID/ PACKAGING. This will enable the event to address the individual demands of the PCB industry more specifically. PCB manufacturers have always featured amongst the SMT/HYBRID/ PACKAGING exhibitors – and successfully, too. The 2004 event sees a clear increase in the number of companies from this sector, providing visitors with an even more comprehensive range of PCB products and services.

By first July 2006, it is vital that lead-free manufacturing processes will be able to guarantee the production of electronic components, which are reliable. The move towards lead-free electronics production is not only a considerable step for the technology sector; the supply industry will have to overcome huge logistical hurdles to ensure delivery of the components. The still high demand for information can be satisfied at the Joint Stand "Service Point Lead-Free", instigated by the ELEKTRONIKPRAXIS magazine, where various companies present their range of services and products.

The parallel SMT/HYBRID/PACKAGING Conference including tutorials is the most important practice oriented platform for presenting and discussing the results of new research, applications and user reports in the microelectronics branch. The focus of the 2004 conference is: "The PCB – a new system platform by using embedded components". The considerable challenge being faced by all developments in the electronic components sector is the increase in performance of the PCB at the least cost possible. Whilst in this context until now the focus has been on wiring boards with very delicate structures with microvia connections, wiring boards with integral passive and active components as well as optical signal paths are becoming increasingly important.

The 2004 conference which will involve leading industrial partners will devote 1 day to this very topical theme to look at issues ranging from design through to product examples. The program includes, moreover, 25 user-oriented half-day tutorials on current and future developments in advanced electronic assembly production with regard to the entire net production chain from design through process technologies to quality assurance. However, the main topic throughout the tutorials is lead-free. Seven tutorials focus on the conversion to lead-free addressing the high demand of information within the industry. The complete conference and tutorial program will be published at the event homepage shortly after the event.

Further information and the latest exhibitor list can be found on the Web site:

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