DEK's 100 percent Via Fill process wins Apex 2004 Innovative Technology Showcase Award

Soldering & Surface Mount Technology

ISSN: 0954-0911

Article publication date: 1 August 2004

Keywords

Citation

(2004), "DEK's 100 percent Via Fill process wins Apex 2004 Innovative Technology Showcase Award", Soldering & Surface Mount Technology, Vol. 16 No. 2. https://doi.org/10.1108/ssmt.2004.21916bab.008

Publisher

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Emerald Group Publishing Limited

Copyright © 2004, Emerald Group Publishing Limited


DEK's 100 percent Via Fill process wins Apex 2004 Innovative Technology Showcase Award

DEK's 100 percent Via Fill process wins Apex 2004 Innovative Technology Showcase Award

Keywords: IPC, DEK, Awards

The IPC Association recently commended DEK's technological advances with its new Via Fill process. Awarded a slot in the Innovative Technology Showcase at the Apex exhibition in Anaheim, California, DEK's 100 percent fill technology was described by the judges as "groundbreaking".

DEK representative comments, "Like most of our products, the Via Fill process was developed in response to customer requirements. We're delighted that it has been recognised as cutting- edge technology by the IPC Association and believe that our broad-ranging customer base will continue to inspire further technological advances at DEK".

As part of the Innovative Technology Showcase at Apex, DEK's Via Fill process that delivers 100 percent fill of substrate vias with no voids and minimal surface residue, will demonstrate what the IPC describes as "new and emerging technologies". This Pro-Flow-based process offers solutions to problems such as insufficient fill, voiding, poor throughput and excessive handling of product associated with conventional methods.

For further information, visit the Web site: www.dek.com