Area Array Packaging Handbook

Citation

(2004), "Area Array Packaging Handbook", Soldering & Surface Mount Technology, Vol. 16 No. 1. https://doi.org/10.1108/ssmt.2004.21916aae.005

Area Array Packaging Handbook

Area Array Packaging Handbook

Keywords: Area array, Packaging

Ken GilleoMcGraw-Hill Handbooks

Thirty-one chapters covering all you need to know about the use, design, assembly and inspection of area array devices; also the implications and challenges for new processes and materials. The text reads well and is well illustrated with product, process issues and of course equipment shots. There is no question that any engineer would thus benefit from reading this text from cover to cover and would benefit his company in doing so. Of particular interest were the section by Daniel Baldwin on flip chip, reliability section by Raza Ghaffarian and of course Gilleo holding things together creating a smooth transition between topics. There are some other books with multiple contributors that do not link that well.

Ken explained the first introduction of flip chip in the 1960s and the problems faced by the early innovators. This chapter includes over 20 pages, starts at the beginning with IBM use of direct chip attach (DCA) and also acknowledges Fairchild for their early contribution. The chapter brings the reader through the stages of innovation, it does not really conclude as technology moves on each day. Ken also outlines the growing demand for microelectromechanical system (MEMS), which could be a book in its own right and probably will be.

Marie Cole provides an insight into ceramic ball and column grid array packages, which was very informative, just like her workshops for IBM. She was voted one of the best workshop leaders at a past SMART Group European Conference. This reviewer was most interested in the simple techniques used to rework ceramic components; it is amazing what can be done with bath of hot oil and a squeegee blade.

It was a little disappointing to this reviewer that it took a trip to the US to get a copy of this title from McGraw-Hill offices, many thanks to Steve Chapman. When so much effort is put into releasing so many strong titles in the electronics field, other offices should promote the products more aggressively.

I look forward in meeting Ken Gilleo again during one of his workshop this year or next and getting him to sign my review copy. Perhaps I should wait and get him to sign the second edition which, I believe, is even bigger and heavier.

Bob Willis2 Fourth Ave. Chelmsford, Essex, CM1 4HA.Tel: 01245 351502Fax: 01245 496123Mobile: 07860 775858E-mail: bob@bobwillis co.ukWebsite: www.leadfreesoldering.com and www.bobwillis.co.uk