Siemens Dematic unveils Siplace HF/3 placement machine at Productronica

Soldering & Surface Mount Technology

ISSN: 0954-0911

Article publication date: 1 April 2004

63

Keywords

Citation

(2004), "Siemens Dematic unveils Siplace HF/3 placement machine at Productronica", Soldering & Surface Mount Technology, Vol. 16 No. 1. https://doi.org/10.1108/ssmt.2004.21916aad.012

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:

Emerald Group Publishing Limited

Copyright © 2004, Emerald Group Publishing Limited


Siemens Dematic unveils Siplace HF/3 placement machine at Productronica

Siemens Dematic unveils Siplace HF/3 placement machine at Productronica

Keywords: Siemens

Once again, the electronic assembly (EA) systems division of Siemens Dematic enhanced its position as the global innovation leader in the industry. Only 6 months after the introduction of the dual- gantry Siplace HF with two distinct placement areas, Siemens Dematic presented the world’s first three-gantry Siplace HF as an evolution of the modular Siplace platform with an optimum cost- benefit ratio at Productronica.

The new Siplace HFI3 is based on the proven Siplace platform and is equipped with all the innovative features of the Siplace HF – the new placement head, the new transport system and the new drives for flexible and fast placement. A third gantry enhances the placement machine’s production and flexibility even further. Like the other two gantries, this additional gantry can accept any available placement head, depending on the job requirements: an additional twin-head for even more flexibility, a six-segment collect and place head for more speed with larger components, or a twelve-segment collect and place head for maximum speed with smaller components.

The new HF/3 adds even more performance to the technological innovations of the Siplace HF platform and can be employed with maximum flexibility. The new machine places components that range from 0201, flip-chips and CCGAs to custom components with 100 g and dimensions of 85 × 85/125 × 10 mm at a rate up to 45,000 components per hour. This makes the HF/3 by far the most powerful end-of-line placement machine in the market, with a cost per placement that is unbeatable. The Siplace HF/3 can be integrated into any production line where line performance and flexibility are important. Like all other Siplace modules, it can be installed in a wide variety of production environments.

In addition to the new HF/3, Siemens Dematic demonstrated their entire product spectrum at Productronica, from placement machines and software modules to their service offerings. These modules can be combined into a wide variety of applications for any type of industry – automotive, IT or telecom. Siplace is the platform for increased productivity, lower operating costs and greater profitability – predestined for costsensitive areas that must produce top quality.

For further information about Siplace, visit the Web site: www.siplace.com

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