Keywords
Citation
(2004), "Ready for lead-free", Soldering & Surface Mount Technology, Vol. 16 No. 1. https://doi.org/10.1108/ssmt.2004.21916aad.007
Publisher
:Emerald Group Publishing Limited
Copyright © 2004, Emerald Group Publishing Limited
Ready for lead-free
Ready for lead-free
Keywords: Lead-free soldering
As the industry pursues lead-free technologies, the Metcal single head design helps achieve a consistent, tight Delta T across the board and the component. Metcals insight means that the systems reflow heater and pre-heaters are perfectly suited for the higher temperatures required by lead-free assemblies. Thermal damage is avoided due to the systems precisely controlled pre-heaters; sophisticated lead-free profiles can be quickly developed via the systems five thermocouples; and the closed-loop computer controls and intuitive software help operators maintain the ideal process that is essential when reworking lead-free devices.
Owing to the thermal sensitivity of array packages, the ability to ramp temperatures at a rate that will not harm them is crucial. Consequently, the APR-5000-XLS employs four heating zones and one cooling zone. In addition, the systems controlled pre-heaters help to avoid the risk of thermal damage associated with exposing heat-sensitive components, unsuitable for heating above 240°C, with quick reflow times.
"Fast set-up" consistent results
Set-up of the APR-5000-XLS is fast. Process calibration is easy and remains consistent from operator to operator, machine to machine. Metcal software is both instructive and intuitive, walking the engineer through the steps of process development and then instructing the operator to ensure consistent execution of the automatic profile functions. Process and profile files can be saved and password-protected, making them transferable to similar systems globally to achieve process and operation repeatability and control.
For further information on Metcals APR-5000- XLS array package rework system, contact: E-mail: nmorin@okinternational.com