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Emerald Group Publishing Limited
Copyright © 2004, Emerald Group Publishing Limited
Exhibitions and conferences
SMT/HYBRID/ PACKAGING 2004
Keywords: Conferences, Surface mount technology, Packaging
Solutions, products and services around System Integration in Microelectronics will be shown at SMT/HYBRID/PACKAGING 2004 taking place during 15-17 June 2004 in Nuremberg. The number of participating companies shows a positive development, and a broad spectrum of companies, from newcomers with niche products through to the market leaders, is exhibiting at the event. Both the quality and the quantity of the exhibiting companies show the huge significance of the event for the industry, with the exhibits ranging from PCBs, soldering, screen printing and hybrids through to new placement technologies and various new developments in the electronics sector.
The SMT/HYBRID/PACKAGING is the most important showcase for product areas including production technologies for PCBs, component production, soldering technologies and testing equipment.
The SMT/HYBRID/PACKAGING 2004 exhibition and conference offer engineers and technicians plenty of opportunities to update themselves on the trends and new technologies in the SMT industry at first hand. All kinds of solutions, products and services related to System Integration in Microelectronics will be on display – all under one roof during 15-17 June 2004 in Nuremburg.
In response to the demands of the market, SMT/ HYBRID/PACKAGING 2004 will be offering an Opto-electronic joint stand. With its comprehensive presentation of the theme via a display and presentation forum, it shows the rapid development in this area.
In the exhibition halls, the SMT Forum offers a platform for discussions and company and product presentations, which will be a magnet for visitors as in recent years.
The parallel SMT/HYBRID/PACKAGING conference and tutorials are the most important practically oriented platform for the presentation of recent research results, solutions and user reports. The focus of the 2004 conference, under the chairmanship of Professor Dr-Ing. Herbert Reichl, of the Fraunhofer Institute of Reliability and Microintegration, Berlin, will be the topical theme of The PCB – a new system platform using embedded components. A whole day at the conference will be devoted to this theme. In addition, 24 user oriented half-day tutorials on the latest and future developments in microelectronics assembly over the complete value added chain will be scheduled.
The latest details are available on the SMT Web site: www.smt-exhibition.com