Keywords
Citation
(2003), "Heraeus introduces top performing no-clean solder paste", Soldering & Surface Mount Technology, Vol. 15 No. 3. https://doi.org/10.1108/ssmt.2003.21915cad.004
Publisher
:Emerald Group Publishing Limited
Copyright © 2003, MCB UP Limited
Heraeus introduces top performing no-clean solder paste
Heraeus introduces top performing no-clean solder paste
Keywords: Solder paste, Heraeus
W.C. Heraeus GmbH has launched the F10, a high-performance no-clean L solder paste with exceptional solderability and printability.
F10 has been shown to produce significant reductions in defect rates and to improve process yields in comparison with other no-clean solder pastes.
Beta testing has demonstrated higher first-pass yields using F10 in production conditions than can be achieved with other no-clean solder pastes. Independent laboratory testing has qualified F10 as an L no-clean solder paste.
The new F10 provides unparalleled air reflow wetting on difficult surface finishes. A proprietary blend of high-performance activators enables the paste to produce complete fine-pitch pad coverage after reflow with as little as 50 per cent pad coverage before reflow on leading OSP board finishes.
F10 eliminates hot slump, which can lead to solder defects, to achieve high first-pass yields.
For more details, visit the Web site: www.4cmd.com