Keywords
Citation
(2003), "Gelease MG-200 developed by Thermoset", Soldering & Surface Mount Technology, Vol. 15 No. 2. https://doi.org/10.1108/ssmt.2003.21915bad.012
Publisher
:Emerald Group Publishing Limited
Copyright © 2003, MCB UP Limited
Gelease MG-200 developed by Thermoset
Gelease™ MG-200 developed by Thermoset
Keyword: Thermoset
Thermoset, Lord Chemical Products has developed Gelease™ MG-200, a thermally conductive material that combines the extremely low thermal resistance properties of grease with the integrity of a gel. Gelease™ MG-200 has a bulk thermal conductivity of 3.0 W/mK and a cure schedule of 3 h at room temperature. This material has a low viscosity of 100,000 cps (0.3 rpm) at 258° C and high volume resistivity. Due to its composition, Gelease™ MG-200 exhibits excellent flow properties, is easily dispensed through static mixers and is reworkable (Plate 6).
Plate 6
Gelease™ MG-200 exhibits excellent flow properties
Gelease™ MG-200 is designed to provide the most efficient heat transfer from Flip Chip microprocessors, PPGAs, BGAs, microBGAs, DSP chips, graphic accelerator chips and other high wattage electronic components. The crosslink structure of this formulation inhibits bleed, separation and pump-out, which is typically associated with many thermal interface materials.