Keywords
Citation
(2003), "The SMTA recognizes outstanding authors", Soldering & Surface Mount Technology, Vol. 15 No. 2. https://doi.org/10.1108/ssmt.2003.21915bab.004
Publisher
:Emerald Group Publishing Limited
Copyright © 2003, MCB UP Limited
The SMTA recognizes outstanding authors
The SMTA recognizes outstanding authors
Keyword: SMTA
As speakers at SMTA International, individuals make contributions to the industry by sharing their research and findings. To reward exceptional achievement, $1,000 awards and plaques are given for the Best Conference Paper, Best Proceedings Paper and the Best International Paper. Respectively, the winners from SMTA International 2002 are Ian Fleck of Cookson Electronics, Fay Hua et al., Intel Corporation and W.T. Chen et al., National Central University.
Fleck was awarded the Best Conference Paper for his work entitled "A New Dimension in Stencil Print Optimization".
Hua and her co-authors won the Best Proceedings Paper award for their article, "Solder Joint Reliability of Sn-Ag-Cu BGA Components Attached with Eutectic Pb-Sn Solder Paste".
Chen and his co-authors received the Best International Paper award for their article entitled "Effect of Cu Concentration on the Solid-State Aging Reactions Between SnCu Lead-Free Solders and Ni".