TY  - JOUR
AB  - 
VL  - 13
IS  - 1
SN  - 0954-0911
DO  - 10.1108/ssmt.2001.21913aab.009
UR  - https://doi.org/10.1108/ssmt.2001.21913aab.009
PY  - 2001
Y1  - 2001/01/01
TI  - SSTC. Solder paste suppliers debate future developments at SSTC autumn conference
T2  - Soldering & Surface Mount Technology
PB  - Emerald Group Publishing Limited
Y2  - 2024/04/25
ER  -