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Heraeus PD966 high speed adhesive

Soldering & Surface Mount Technology

ISSN: 0954-0911

Publication date: 1 December 2000

Article view Figure view Cited (2) cite article

Keywords

  • Heraeus
  • Adhesives

Citation

(2000), "Heraeus PD966 high speed adhesive", Soldering & Surface Mount Technology, Vol. 12 No. 3. https://doi.org/10.1108/ssmt.2000.21912cad.022

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Publisher

:

Emerald Group Publishing Limited

Copyright © 2000, MCB UP Limited


Heraeus PD966 high speed adhesive

Heraeus PD966 high speed adhesive

Keywords Heraeus, Adhesives

The solvent-free PD966 is a thermosetting, single-component, polymer adhesive that is designed for gluing underside SM components on to mixed technology PCBs (prior to wave soldering) or for mounting them onto bare board substrates (Plate 7).

Plate 7 The solvent-free adhesive PD966

Based on the reliable and production-proven Heraeus PD955M glue, the new PD966 adhesive has been optimised to avoid stringing and offers both a very high surface insulation resistance (SIR) and low humidity absorption characteristic. In addition, the PD966's rheology has been specially engineered for high speed dispensing while allowing for a very low Z-height-return: (the height above the board that the dispense head can safely retract to upon completion of a dispense cycle). One of the most powerful capabilities of the new PD966 adhesive, however, is its ability to deliver highly stable glue dots that offer an excellent board-to-component adhesion (typically 25N/mm2) with even the most difficult-to-glue components.

Although the PD966 has been designed for high speed dispensing, it is easy to apply and will produce equally impressive results when dispensed manually. It also enjoys a wide processing window and will cure in three minutes at a standard 125°C. After its application, any excess uncured adhesive can be easily removed with either an alcohol or water-based cleaning solution. Because of the known residual thermoplasticity of the PD966 cured adhesive, it is also easily reworkable. Defective components can be quickly replaced by simply heating (with hot air) a cured adhesive joint to 100°C (or above) and removing via a torsion movement. Any remaining adhesive can be similarly removed with a sharp tool.

To ensure excellent batch-to-batch consistency, the PD966 is manufactured to Heraeus' quality control standards and comes in a range of machine-specified syringe formats to suit any vendor's dispenser.

Further information: Hereaus Materials Ltd, UK. Tel: +44 (0) 1932 332306; Fax: +44 (0) 1932 347904; E-mail: jim@4hml.com

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