New stencil printer from Speedline MPM delivers competitive price-performance ratio

Soldering & Surface Mount Technology

ISSN: 0954-0911

Article publication date: 1 August 2000




(2000), "New stencil printer from Speedline MPM delivers competitive price-performance ratio", Soldering & Surface Mount Technology, Vol. 12 No. 2.



Emerald Group Publishing Limited

Copyright © 2000, MCB UP Limited

New stencil printer from Speedline MPM delivers competitive price-performance ratio

Keywords Speedline Technologies, Stencil printers

Speedline MPM's newest stencil printer combines a base platform with many cost-effective options and product improvements that can be easily configured to process both SMT and non-SMT boards. The UP1500 offers considerable product flexibility and is capable of printing boards up to 558mm x 508mm (22" x 20") in size. Standard features on the UP1500 include MPM's patented automatic board-to-stencil alignment, a self-levelling dual squeegee print head, programmable hard board stops and a Microsoft Windows NT operating system. Additionally, a compact welded and stress-relieved tubular steel frame supports the UP1500, providing stability and durability.

To increase printer uptime, a support pin placement system automatically places support pins within a programmable pattern, ensuring a flat board support surface, while programmable rail width adjustment and automatic stencil positioning systems effectively cut minutes out of product changeover operations. Additionally, board transport time is reduced through the printer's multi-stage conveyor system that manages up to three boards within the printer simultaneously.

To ensure the highest yields, several product options are available that open up the printing process window.

  • A unique real-time closed-loop squeegee pressure control system independently monitors front and rear squeegee pressure at the blade contact edge, utilising the shortest possible feedback to deliver precise sensitivity for precise print results.

  • An independently programmable vacuum stencil cleaning system removes stubborn solder paste from stencil apertures, eliminating "opens" on the final assembly.

  • A 2D verification tool provides quantitative performance measurements of paste coverage, advising line intervention when the print process is out of control.

  • Speedline MPM's Rheometric Pump printing system combines advanced features and proven technology to yield superior paste management while also reducing waste by as much as 90 percent.

For further information contact: Zoe Gemmell, Speedline Technologies, Unit 1, Pincents Kiln Industrial Park, Reading RG31 7SD, UK. Tel: +44 (0) 118 930 1400; Fax: +44 (0) 118 930 1401; E-mail:

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