(2000), "Successor to existing reflow soldering methods and lead-free Synergie(TM) launched by Concoat at Nepcon UK", Soldering & Surface Mount Technology, Vol. 12 No. 2. https://doi.org/10.1108/ssmt.2000.21912bad.017
Emerald Group Publishing Limited
Copyright © 2000, MCB UP Limited
Successor to existing reflow soldering methods and lead-free Synergie(TM) launched by Concoat at Nepcon UK
Successor to existing reflow soldering methods and lead-free SynergieTM launched by Concoat at Nepcon UK
Keywords Concoat, Soldering
Concoat launched two major products at Nepcon UK. The first was a unique soldering process that threatens to completely supersede existing reflow methods; and the second was the first lead-free additions to the company's SynergieTM range of compatible electronics process chemistries.
The new condensation soldering process is designed to combat the problems of reflow soldering increasingly small and densely populated boards and components which can be easily damaged by overheating.
The Delta 5 soldering system guarantees extremely small temperature differentials plus a highly precise and controllable heating profile that is often beyond the capabilities of traditional IR, vapour phase or forced convection reflow methods (Figure 1).
Figure 1 The Delta 5 soldering system, successor to existing reflow soldering methods, and lead-free Synergie TM, to be launched by Concoat at Nepcon UK
For further information please contact: Graham Naisbitt, Managing Director, Concoat Limited, Frimley Road, Camberley, Surrey GU15 2PL, UK. Tel: +44 (0) 1276 691100; Fax: +44 (0) 1276 691227; E-mail: firstname.lastname@example.org