Loctite launches the first commercially available reworkable underfill

Soldering & Surface Mount Technology

ISSN: 0954-0911

Article publication date: 1 August 2000

Keywords

Citation

(2000), "Loctite launches the first commercially available reworkable underfill", Soldering & Surface Mount Technology, Vol. 12 No. 2. https://doi.org/10.1108/ssmt.2000.21912bad.005

Publisher

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Emerald Group Publishing Limited

Copyright © 2000, MCB UP Limited


Loctite launches the first commercially available reworkable underfill

Keywords Loctite, Underfill, Rework

Package rework is a normal occurrence in board level assembly. And now there is a fast flowing, snap cure underfill that allows for package rework, virtually eliminating costly board disposal. With new Loctite 3567 reworkable underfill, CSP and flip chip assemblies can be easily replaced, even after the underfill has cured. By heating the package to standard rework temperatures, the underfill releases and the defective device is easily removed from the PCB.

A solvent-free cleanup involving gentle high speed brushing will eliminate any remaining residue and prepare the site for the replacement device. Curing in just five minutes at 165°C, Loctite 3567 is one of the fastest processing underfills on the market today, and the only one that is reworkable.

For more information and evaluation samples, point your browser to http://www.loctite.com/new/3567release.html