Keywords
Citation
(2000), "SMTA conference at NEPCON East 2000 features 14 in-depth sessions and lead-free symposium", Soldering & Surface Mount Technology, Vol. 12 No. 2. https://doi.org/10.1108/ssmt.2000.21912bac.004
Publisher
:Emerald Group Publishing Limited
Copyright © 2000, MCB UP Limited
SMTA conference at NEPCON East 2000 features 14 in-depth sessions and lead-free symposium
Keywords NEPCON, Conferences
Expanded educational opportunities at NEPCON East 2000, the North-east's leading source for electronics manufacturing solutions, include an SMTA-sponsored conference and two-day symposium on lead-free interconnect technology. The conference and exhibition will take place 12, 13 and 14 June 2000 at the Bayside Exposition Center in Boston, MA.
Featuring four in-depth, day long sessions and ten half day sessions, the SMTA conference will touch on many of the industry's hottest topics, including:
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BGA and CSP overview, implementation and reliability;
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BGA and CSP rework: theory, methods and applications;
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correctly implementing the make-buy decision by understanding true manufacturing costs;
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design for SMT manufacturability from an assembly point of view;
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IPC-610 comparison clinic;
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lead free solders: year 2000 and beyond;
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microvia and high density interconnect: material selection, fabrication processes, and design guidelines;
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new and emerging technologies for electronic packaging and assembly;
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process control in electronics assembly;
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reflow soldering and troubleshooting for SMT, BGA, CSP and flip chip processes;
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SMT stencil and printing inspection;
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solder paste reflow for through hole technology;
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troubleshooting the wave soldering process;
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troubleshooting the reflow soldering process.
Complete conference information, including registration forms, session descriptions, course schedules and speaker names, may be obtained by visiting www.nepcon.com or www.smta.org.