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Flextronics completes acquisition of the Dii Group
Keywords Flextronics, The Dii Group, Mergers and acquisitions
Flextronics International Ltd has completed its acquisition of The Dii Group, Inc. Obtained in a tax-free, stock-for-stock agreement, The Dii Group acquisition is designed to expand Flextronics' printed circuit board operations, design services and geographic locations. The combined company is the fourth largest provider of electronics manufacturing services by revenues and second largest by market capitalization, with strengths in telecommunications, consumer electronics, PCB fabrication and design services.
"The Internet and creation of a global marketplace are driving companies to find faster ways to design, manufacture, and distribute customer products internationally," said Michael E. Marks, chairman and chief executive officer of Flextronics. "Flextronics has been able to quickly provide these companies with one of the industry's largest global manufacturing infrastructures through a series of carefully planned acquisitions. Just as our customers are driven by the need to respond to their market needs, this acquisition is all part of an overall plan that allows us to quickly react to their needs."
Along with its physical expansion across the globe, Flextronics is also a leader in expanding the traditional role of an electronics manufacturing services provider. The company completely manages the product lifecycle from product design all the way through to distribution to the end user. Flextronics offers its customers the ability to take orders off the Internet, build them to order, and ship them to any part of the globe.
The acquisition of The Dii Group will improve Flextronics in a number of important areas, including:
Expands Flextronics' network of global manufacturing facilities. The company will gain a manufacturing presence in Ireland, Germany and the Czech Republic, and will expand its PCB assembly capacity in China, Malaysia, Mexico, Austria and the USA.
Enhances its printed circuit board fabrication offering by adding the capability of manufacturing larger multilayer boards of up to 68 layers and provides advanced PCB manufacturing capabilities in California, Minnesota, Texas, Germany, China and Brazil.
Provides semiconductor design centers in California, Arizona, India and Israel.
Expands Flextronics' backplane fabrication and manufacturing assembly.
Provides new customer relationships, and strengthens existing relationships.