5th annual new and emerging technologies for electronics packaging and assembly

Soldering & Surface Mount Technology

ISSN: 0954-0911

Article publication date: 1 August 2000




(2000), "5th annual new and emerging technologies for electronics packaging and assembly", Soldering & Surface Mount Technology, Vol. 12 No. 2. https://doi.org/10.1108/ssmt.2000.21912bab.010



Emerald Group Publishing Limited

Copyright © 2000, MCB UP Limited

5th annual new and emerging technologies for electronics packaging and assembly

1-2 November 2000, Dallas Convention Center, Dallas, Texas

Conference co-chairs: Steve Greathouse, Intel Corporation and Reza Gharaffian, Jet Propulsion Labs.

Papers are being sought on the following key topics:

  1. 1.

    Embedded and integrated passives:

    • design tools;

    • advances in high frequency passives;

    • antenna and shielding components;

    • materials/fabrication technologies;

    • comparisons of performance data, case studies.

  2. 2.

    High density packaging:

    • design;

    • test;

    • substrates;

    • assemblies;

    • RF/wireless;

    • applications;

    • packages and applications;

    • materials;

    • interfaces.

  3. 3.


    • soldering technology;

    • materials (solders, adhesives, flux);

    • process implementation;

    • performance and reliability;

    • standards/specifications;

    • environmental implications;

    • board assembly issues;

    • surface finishes;

    • case studies.

  4. 4.

    Signal integrity:

    • electrical and constants of materials;

    • design considerations for signal improvement;

    • methods of shielding;

    • high speed signal compensation methods.

  5. 5.

    Test in today's manufacturing environment:

    • design for test;

    • automated fixturing;

    • in-circuit test;

    • impact of automation;

    • automated functional test;

    • in-process test-MDA, vision, X-ray;

    • test implementation;

    • case studies.

  6. 6.

    Flip chip technology:

    • advances and implementation;

    • underfill technology;

    • reliability modeling;

    • FC in MEMs, RF and bioelectronics;

    • integration and reliability;

    • high density microvia substrates;

    • packaging applications;

    • advances in bumping and interconnect technology.

  7. 7.


    • package design and standardization;

    • materials and processes;

    • quality and reliability specification and evaluation;

    • performance requirements (chemical and mechanical);

    • cost modeling and design for manufacture;

    • application case studies.

If you have an interest in participating, please complete the abstract submission and attach a short one-page abstract of your paper, and fax, e-mail, or mail to the SMTA.

Abstracts should offer non-commercial, user-oriented solutions in any of the disciplines in electronic packaging or manufacturing. Papers will be accepted based on the submitted abstract and the judgment of the conference co-chairs. Previously presented papers, papers not complying with the publication guidelines, and papers that describe or promote a company or company's products will not be accepted. Since the paper selection process is competitive, clearly describe your work, explain its significance and what is new, highlight novel features, provide supporting data and include practical result/conclusions and references to prior work. Authors will be notified of their acceptance, and publication guidelines will be provided. A copy of the manuscript (including a computer disk) must be received no later than 18 September 2000.

Mail, fax or e-mail a one page abstract, including a brief biography, no later than 16 June to: Carla Heckathorne, SMTA 5200 Willson Road, Suite 215, Edina, MN 55424-1343. Tel: +1 952-920-7682; Fax: 952-926-1819; E-mail: carla@smta.org www.smta.org

Important dates:Abstracts: 16 June.Acceptance: 16 July.Manuscripts: 18 September.

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