SMTA announces national conference on lead-free

Soldering & Surface Mount Technology

ISSN: 0954-0911

Article publication date: 1 August 2000

Keywords

Citation

(2000), "SMTA announces national conference on lead-free", Soldering & Surface Mount Technology, Vol. 12 No. 2. https://doi.org/10.1108/ssmt.2000.21912bab.008

Publisher

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Emerald Group Publishing Limited

Copyright © 2000, MCB UP Limited


SMTA announces national conference on lead-free

SMTA announces national conference on lead-free

Keywords SMTA, Lead-free soldering

The SMTA's technical program on 13-14 June, entitled "Advanced electronics assembly - a symposium on lead-free interconnect technology", will bring together individuals who have experience with lead-free solders; not only with the materials themselves, but also with manufacturing issues and reliability concerns.

Dr Paul Vianco, Sandia National Labs, will be chairing the event. Each of the four subsequent sessions will also be chaired by industry experts. These include: Pb-free soldering technology chaired by Ken Gilleo, Alpha Metals; Dr Jennie Hwang, H-Technologies Group, Materials; Srinivas Chada, Motorola, will chair Process implementation; and Interconnect performance and reliability will be chaired by Peter Biocca of Multicore Solders.

For more information contact Carla Heckathorne, SMTA. Tel: +1 952-920-7682; e-mail: carla@smta.org; or find complete details at www.smta.org