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Copyright © 2000, MCB UP Limited
IPC issues call for papers for IPCWORKS 2000
Keywords IPC, Conferences
IPC has issued a call for papers for IPCWorks 2000, taking place 9-15 September, at the Hyatt Regency Miami.
IPCWorks 2000, home to IPC's Fall meeting, will host a number of IPC committee meetings that provide attendees with the opportunity to contribute to the development of standards that shape the printed wiring board and electronics assembly industries.
The focus of this three-day technical conference is HASLs of Assembling in the New Millennium. Papers are being sought on this issue in all areas, including:
innovations with alternative metals (Au/Ni, Pd,/NI, etc.);
assembly related issues;
component lead to surface finish interactions;
organic solderability preservatives;
testing and analysis (SERA, wetting balance, etc.);
end product requirements; and
IPC is sponsoring an update to its International Summit on Lead-Free Electronics Assemblies, held at IPCWorks '99, with a one-day, one-track session on what has occurred in the past year. Topics of this session will include an update on pending legislation and activities in Japan, reports from companies producing lead-free product and industry forecasts.
Papers are sought in all areas for this session, including: legislative updates; field data for existing product; alloys; and PWB finishes.
IPCWorks 2000 offers time slots of 30 minutes and one hour. Some papers may be grouped together in a forum for panel discussion. Stand alone free forums and round-table discussions are encouraged. Half-day and full-day workshops will be considered.
Presentation materials and papers must be non-commercial in nature, focusing on technology rather than a company's product. It is mandatory to provide a print-quality paper or hard copies of visuals for the conference proceedings in order to deliver an oral presentation. The deadline to submit abstracts for presentations is 1 June, 2000.