Soldering & Surface Mount Technology

ISSN: 0954-0911

Article publication date: 1 August 2000




(2000), "IPC", Soldering & Surface Mount Technology, Vol. 12 No. 2. https://doi.org/10.1108/ssmt.2000.21912bab.004



Emerald Group Publishing Limited

Copyright © 2000, MCB UP Limited


Keywords IPC, Exhibitions, Electronics

IPC is issuing a call for papers for the IPC SMEMA Electronics Assembly Process Exhibition and Conference (APEXSM), taking place 14-18 January 2001, at the San Diego Convention Center.

This event is being produced by the IPC SMEMA Council for the electronics assembly industry to provide a cost-effective and focused forum for user/supplier dialogue. Papers are being sought in all areas dealing with:

  • advanced packaging;

  • assembly processes;

  • factory equipment and automation;

  • material developments;

  • component technology;

  • environmental concerns;

  • electronic manufacturing services;

  • test and quality;

  • industry standards; and

  • business issues.

For a complete list of topics, visit the APEX Website at www.apex2001.org. Papers should be between six and 12 pages in length (text and graphics), and should describe significant results from experiments, emphasize new techniques, discuss trends of interest, and contain technical and/or appropriate test data. Papers should also focus on the technology and should not be commercial in nature. Commercial-oriented papers will not be accepted.

It is mandatory to provide a print-quality paper for the conference proceedings in order to deliver a presentation. Abstracts for paper presentations are due by 12 May 2000. They should be submitted with a brief biography by e-mail to Martin Barton, APEX conference director, at martinbarton@home.com. Abstracts should not be faxed.

For more information on submitting an abstract for a paper presentation at the IPC SMEMA Electronics Assembly Process Exhibition and Conference, contact Martin Barton at +1 (972) 424-8805.

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