TY  - JOUR
AB  - 
VL  - 12
IS  - 1
SN  - 0954-0911
DO  - 10.1108/ssmt.2000.21912aad.011
UR  - https://doi.org/10.1108/ssmt.2000.21912aad.011
PY  - 2000
Y1  - 2000/01/01
TI  - New solderpastes: high-speed, fine pitch and lead-free
T2  - Soldering & Surface Mount Technology
PB  - Emerald Group Publishing Limited
Y2  - 2024/04/24
ER  -