Speedline ACCEL's new MicroPro&#153 integrates the reflow and cleaning process

Soldering & Surface Mount Technology

ISSN: 0954-0911

Article publication date: 1 April 2000

Keywords

Citation

(2000), "Speedline ACCEL's new MicroPro&#153 integrates the reflow and cleaning process", Soldering & Surface Mount Technology, Vol. 12 No. 1. https://doi.org/10.1108/ssmt.2000.21912aad.005

Publisher

:

Emerald Group Publishing Limited

Copyright © 2000, MCB UP Limited


Speedline ACCEL's new MicroPro&#153 integrates the reflow and cleaning process

Speedline ACCEL's new MicroPro&#153 integrates the reflow and cleaning process

Keywords: Speedline ACCEL, Reflow, Cleaning, Ball grid array

Speedline ACCEL's new MicroPro&#153 integrates the reflow and cleaning processes and provides fully automated processing of singulated parts in boats, trays, and other carriers, in addition to individual strips and arrays containing multiple parts (Plate 4). Speedline's MicroPro&#153 is the latest innovation from Speedline ACCEL's centrifugal and in-line cleaning systems, which also includes MicroCel, MicroCel 2, MicroLine and MicroLine 2.

Plate 4Speedline ACCEL's new MicroPro™

MicroPro&#153 integrates two individual manufacturing processes typically requiring separate systems for reflow and cleaning of BGA packages. An effective reflow process, optimised for packages, is performed in a unique thermal control section using a highly refined temperature profile.

An additional section, dedicated to the specific task of BGA cleaning, completely removes all flux residue traces with wash and rinse steps, followed by a dry step which totally eliminates residual rinse water. Incoming parts automatically advance through all process steps, with their solder spheres contacted by only the liquid and gaseous cleaning agents. The result produces clean, dry, small grain, high lustre, unblemished, and high uniform solder sphere arrays.

MicroPro&#153 also employs a transport system that maintains part orientation and processing regardless of the direction of internal travel. Whether travelling from front-to-rear, or rear-to-front, the length of the part constantly remains in a position that is parallel to the in-line flow direction of the production line. This feature reduces velocity through the two processing zones without lowering through-put, and contributes to MicroPro's size reduction. The transport system is also configured to control cross-contamination between the two processes.

For more information contact: Zoe Gemmell, Speedline Technologies, Unit 1, Pincents Kiln Industrial Park, Reading RG31 7SD, UK. Tel: +44 (0) 118 930 1400; Fax: +44 (0) 118 930 1401; E-mail: zgemmell@speedline.cookson.com