Heraeus introduces lead- and halide-free no-clean solder paste

Soldering & Surface Mount Technology

ISSN: 0954-0911

Article publication date: 1 April 2000

Keywords

Citation

(2000), "Heraeus introduces lead- and halide-free no-clean solder paste", Soldering & Surface Mount Technology, Vol. 12 No. 1. https://doi.org/10.1108/ssmt.2000.21912aad.002

Publisher

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Emerald Group Publishing Limited

Copyright © 2000, MCB UP Limited


Heraeus introduces lead- and halide-free no-clean solder paste

Heraeus introduces lead- and halide-free no-clean solder paste

Keywords: Heraeus, Solder paste, Lead-free soldering

Heraeus Materials has introduced its newly developed F365 Series lead-free solder paste (Plate 1). This revolutionary no-clean paste is designed to be totally compatible with existing production line machinery without demanding extensive optimisation or reconfiguration. It is, in fact, already being used by OEMs who, through long-term partnerships with Heraeus, are drawing on the supplier's extensive lead-free expertise.

Plate 1Heraeus introduces lead- and halide-free no-clean solder

The F365 paste is based on a unique tin-silver-copper (Sn4Ag0.5Cu) alloy mixed with a state-of-the-art halide-free no-clean flux. The ready-to-use paste provides superior performance on a variety of surface finishes and excellent print-to-print consistency. It also leaves a low, clear flux residue with low ionic contamination and high SIR, and can be reflowed under air or an inert atmosphere.

It has also been shown that the F365 low odour paste offers a better thermomechanical solder joint reliability than lead-based alternatives and meets the Bellcore NWRT 00078 flux activity standard and is J-STD Classified L0.

For further information, please contact: Jim Greg, Heraeus Materials Ltd, 1 Craven Court, Canada Road, Byfleet, Weybridge, Surrey KT14 7JL, UK. Tel: +44 (0) 1932 349 315; Fax: +44 (0) 1932 347 904.