Siemens AG and Fabmaster S.A. have signed an OEM agreement

Soldering & Surface Mount Technology

ISSN: 0954-0911

Article publication date: 1 April 2000

Keywords

Citation

(2000), "Siemens AG and Fabmaster S.A. have signed an OEM agreement", Soldering & Surface Mount Technology, Vol. 12 No. 1. https://doi.org/10.1108/ssmt.2000.21912aab.044

Publisher

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Emerald Group Publishing Limited

Copyright © 2000, MCB UP Limited


Siemens AG and Fabmaster S.A. have signed an OEM agreement

Siemens AG and Fabmaster S.A. have signed an OEM agreement

Keywords: Fabmaster S.A., Siemens AG, OEMs

Fabmaster S.A. and Siemens AG of Germany have signed an OEM agreement for Fabmaster to provide a software optimization module for Siemens' SIPLACE electronics assembly equipment. This module, used for optimizing printed circuit board placement programs, will work in conjunction with Siemens' SIPLACE Pro programming software. SIPLACE users will be able to minimize their PCB cycle time, production line changeover time and machine set-up time with the Fabmaster SIPLACE Optimizer.