SSTC. 20th Anniversary Seminar Meeting at NPI

Soldering & Surface Mount Technology

ISSN: 0954-0911

Article publication date: 1 April 2000

Keywords

Citation

(2000), "SSTC. 20th Anniversary Seminar Meeting at NPI", Soldering & Surface Mount Technology, Vol. 12 No. 1. https://doi.org/10.1108/ssmt.2000.21912aab.026

Publisher

:

Emerald Group Publishing Limited

Copyright © 2000, MCB UP Limited


SSTC. 20th Anniversary Seminar Meeting at NPI

SSTC 20th Anniversary Seminar Meeting at NPI

Keyword: SSTC

Dr Colin Lee, OBE, introduced the 20th Anniversary Seminar Meeting of SSTC (Soldering Science and Technology Club), held at National Physical Laboratory on the 4 October 1999.

Owing to major redevelopment of the NPL site at Teddington, this was the last event to be held in the main conference hall.

After a light-hearted review of soldering over the last 20 years at SSTC dedicated to the late Tony Welford, nine technology presentations followed, which included:

  • Latest reliability results from the European collaborative project IDEALS by Jim Vincent, Marconi Materials Technology.

  • Substrates for high temperature soldering, Steve Jones, Viasystems.

  • Graham Jones from Ablestick argued that conductive adhesives are finding increasing markets.

  • Martin Wickham, NPL, shared the wisdom gained from a three-year programme on stencil printing. He later covered the impact on the process issues with device reliability using lead-free alloys.

  • Solderability of lead-free alloys and effects of using nitrogen were presented by Chris Hunt who also covered a study by NPL and Partners of the new palladium finishes, comparing the performance in a number of tests.

  • Keith Whitlaw from Shipley Ronal picked up the lead-free theme with the new component finishes being developed to meet these new challenges.

  • Brian Richards, NPL, gave the latest news and progress with lead-free issues on the world stage.

A highlight of the day was the Solder Paste Panel.

Four suppliers: Alpha Metals; Cobar; Koki and Multicore Solders each presented a different perspective on solder paste technology and then debated the subject with a variety of questions from the audience. Marc Dalderup gave an enthusiastic presentation on the changing parameters of quality aspects of solder paste. Koki surprisingly stated that Japan is looking at flux applicators in lead free wave soldering. Malcolm Warwick presented a very measured, concise view of lead-free solder paste. Steve Brown at Alpha Metals broadened the discussion with an overview of solder paste development.