NPL. The lead-free soldering cook book

Soldering & Surface Mount Technology

ISSN: 0954-0911

Article publication date: 1 April 2000




(2000), "NPL. The lead-free soldering cook book", Soldering & Surface Mount Technology, Vol. 12 No. 1.



Emerald Group Publishing Limited

Copyright © 2000, MCB UP Limited

NPL. The lead-free soldering cook book

The lead-free soldering cook book

Keywords: NPL, Lead-free soldering

Earlier this year saw the launch of the DTI commissioned Lead-Free Report. NPL were part of the consortium who wrote it and took responsibility for the Pb-free helpline. In analysing the feedback, especially from the smaller companies, it was clear that further, more practical information was urgently needed.

An interactive CD-ROM was launched in Europe in November. With the title of the "Lead-free soldering cook book", it contains valuable information to assist industry in the decisions necessary to convert to a Pb-free process. It is the world's first comprehensive resource on the subject of lead-free soldering. Process animation will compare conventional and lead-free production. Helpful video interviews, with key industrial players, will share their experiences. The defect guide section using a library of photographs will help those responsible for maintaining quality. Up to date research and development projects, including what the universities are doing, will be featured as will two separate practical tests covering process and materials. Finally, a comprehensive glossary ensures the "Cookbook" will cover everything you ever wanted to know about lead-free soldering in an easy to use package. It is planned to keep it regularly updated. Organisations will be invited to submit material for future updates.

The "Lead-free soldering cook book" is available priced at £99 + VAT. An early draft is available on the NPL Web page.

For more information contact Dr Brian Richards at: National Physical Laboratory, Teddington, Middlesex, UK TW11 0LW. Tel: +44 (0) 20 8943 6065; Fax: +44 (0) 20 8614 0429; E-mail:; Web:

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