SMART adhesives day

Soldering & Surface Mount Technology

ISSN: 0954-0911

Article publication date: 1 April 2000

Keywords

Citation

O'Rourke, P.J. (2000), "SMART adhesives day", Soldering & Surface Mount Technology, Vol. 12 No. 1. https://doi.org/10.1108/ssmt.2000.21912aab.001

Publisher

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Emerald Group Publishing Limited

Copyright © 2000, MCB UP Limited


SMART adhesives day

SMART adhesives day

Keyword: SMART

The interesting programme for this day was devised by committee members Peter Swanson and Keith Bryant, split roughly into two halves, the morning session focusing on electrically conductives, their value as a replacement for soldered joints and demystifying some of the technical terms. Among the highlights were Dr Martin Bartholomew of Multicore who gave the assembled audience up-date information on their electrically conductive materials. Dr Hugh Fay gave an interesting and humorous presentation explaining the science behind product development with the aid of some unusual props including some envelopes and a banana! These presentations were followed by a lively, open discussion on the future of interconnection technology.

The afternoon concentrated on UV technology, advances in dispense valves and the always interesting and spirited comparison between the merits of printing and dispensing. The speakers from DEK and Speedline outlined the arguments and the relative merits of their subjects very succinctly and honestly, explaining both positives and negatives. From the questions and comments received it was obvious that a good level of information had been exchanged.

Exhibitors included: Loctite, Intertronics, Multicore, OK International, Concoat, DEK, Heraeus, Jenton International, SCSEurope, Emerson & Cumming.