Keywords
Citation
O'Rourke, P.J. (2000), "SMART adhesives day", Soldering & Surface Mount Technology, Vol. 12 No. 1. https://doi.org/10.1108/ssmt.2000.21912aab.001
Publisher
:Emerald Group Publishing Limited
Copyright © 2000, MCB UP Limited
SMART adhesives day
SMART adhesives day
Keyword: SMART
The interesting programme for this day was devised by committee members Peter Swanson and Keith Bryant, split roughly into two halves, the morning session focusing on electrically conductives, their value as a replacement for soldered joints and demystifying some of the technical terms. Among the highlights were Dr Martin Bartholomew of Multicore who gave the assembled audience up-date information on their electrically conductive materials. Dr Hugh Fay gave an interesting and humorous presentation explaining the science behind product development with the aid of some unusual props including some envelopes and a banana! These presentations were followed by a lively, open discussion on the future of interconnection technology.
The afternoon concentrated on UV technology, advances in dispense valves and the always interesting and spirited comparison between the merits of printing and dispensing. The speakers from DEK and Speedline outlined the arguments and the relative merits of their subjects very succinctly and honestly, explaining both positives and negatives. From the questions and comments received it was obvious that a good level of information had been exchanged.
Exhibitors included: Loctite, Intertronics, Multicore, OK International, Concoat, DEK, Heraeus, Jenton International, SCSEurope, Emerson & Cumming.