Speedline Technologies invests in new Asia/Pacific headquarters

Soldering & Surface Mount Technology

ISSN: 0954-0911

Article publication date: 1 December 1999

Keywords

Citation

(1999), "Speedline Technologies invests in new Asia/Pacific headquarters", Soldering & Surface Mount Technology, Vol. 11 No. 3. https://doi.org/10.1108/ssmt.1999.21911cab.030

Publisher

:

Emerald Group Publishing Limited

Copyright © 1999, MCB UP Limited


Speedline Technologies invests in new Asia/Pacific headquarters

Speedline Technologies invests in new Asia/Pacific headquarters

Keywords Speedline, Asia

Assembly and production equipment leader Speedline Technologies has opened a brand new headquarters in Singapore to support its growing customer base in the Asia/Pacific region (Plate 3). The new 25,000sq.ft custom facility houses a customised technology centre, state-of-the-art training rooms, customer support, sales engineering, spare parts, and logistics resources. The technology centre is designed to support the needs of existing and potential customers who wish to carry out live process evaluations, as well as production troubleshooting. It includes a large demonstration area that can accommodate up to two live production lines.

Typical applications being served by Speedline in this way include advanced tasks such as flipchip-on-BGA, and dam-and-fill BGA. All of Speedline Technologies' products will be represented and supported at the new facility, including the Speedline CAMALOT, Speedline MPM, Speedline ELECTROVERT, and the recently incorporated Speedline ACCEL ranges.

Since the amalgamation of these industry-leading brands under the Speedline Technologies identity, the company has grown steadily in the Asia/Pacific region. "This is despite the general downturn in the Asian economy", comments Asia sector vice president Bob Stevens. "This is a testament to the quality of the equipment ranges that now come under the Speedline family."

Plate 3 Speedline Technologies invests in new Asia/Pacific headquarters