Citation
(1999), "electronica 98 - the largest industry gathering ever", Soldering & Surface Mount Technology, Vol. 11 No. 2. https://doi.org/10.1108/ssmt.1999.21911bac.002
Publisher
:Emerald Group Publishing Limited
Copyright © 1999, MCB UP Limited
electronica 98 - the largest industry gathering ever
electronica 98 the largest industry gathering ever
electronica 98, the 18th International Trade Fair for Components and Assemblies in Electronics which celebrated its premiere at the New Munich Trade Fair Centre as the largest electronics trade fair in the world from November 10-13, 1998, was characterized by a sizable increase in the number of exhibits and higher international demand than ever. On a total exhibition space of more than 140,000m2 (110,000m2 at the old trade-fair center), 2,808 exhibitors (+22 percent) and 626 additionally represented companies (+12 percent) from 45 countries (+3) presented the largest range of products and services ever exhibited at an electronics trade fair anywhere in the world; 50 percent of all exhibitors were from abroad.
Some 87,000 trade visitors (+10 percent) from 79 countries in the most important economic regions in the world came to Munich to gather information on the international range of exhibits. As in 1996, the share of visitors from abroad remained at an impressively high 27 percent.
The new trade fair center made it possible to completely reorganize electronica 98 according to new product-group categories. The new structure met with the approval of this year's visitors, 81 percent (+6 percent) of those surveyed rating the fair as "good" to "excellent" with regard to organization. This year's visitors were just as positive about the international character (90 percent) of the fair and the range of exhibits being complete (93 percent).
A total of 88 percent of all exhibitors surveyed rated the visitors' qualifications as "good" to "excellent". According to their own information, 54 percent of all visitors at the fair held upper-management positions at their companies, and 92 percent were directly responsible for purchasing decisions. Besides the traditional electronics sectors, most of the visitors at this year's fair were interested in displays, sensors and microelectronics new sectors celebrating premieres at this year's fair, each with more than 300 exhibitors. All of the exhibition sectors at electronica 98 received the highest marks possible from between 80 percent to more than 90 percent of all exhibitors surveyed.
The visitors at this year's fair also rated electronica as "good" to "excellent" with regard to its effectiveness as a market-orientation tool (88 percent, +3 percent) and the ease with which they were able to locate new developments (76 percent). One out of every four visitors came to Munich to prepare for or to actually make investments at electronica 98.
When asked about the general state of the electronics industry, the basic atmosphere among industry representatives at electronica 98 was extremely positive. Both visitors and exhibitors were far more optimistic in their evaluations than in 1996. Some 74 percent of all visitors (+ 13 percent) rated the general state of the industry as "good" to "excellent", and 43 percent (+ 4 percent) expect the situation to improve even further. Exhibitors were also more positive about the state of the industry than they were two years ago, 96 percent giving the highest marks possible (+ 12 percent) and 84 percent expecting the situation to improve or remain unchanged in the positive sense.
Scottish Exhibition and Master Classes
A small exhibition with 15 exhibitors coupled featuring four, half-day master classes was held at The Scottish Advanced Manufacturing Centre in Livingston on 9-10 December.
Organised by Bob Willis & Mike Judd this event is likely to be repeated at other venues throughout 1999.
SMT/ES&S/Hybrid Conference May 5, 1999
Conference programme
Verarbeitung von BGA Bauelementen
Chair: Dr K.-H. Segsa, Spree Hybrid & Kommunikationstechnik GmbH, Berlin, Germany.
09.00 "Verarbeitung von Ball-Grid-Array Bauelementen in der Großserie"
Dr Volker-Ekkehart Koch, PCS PC Systeme Entwicklungs- und Produktionsgesellschaft, Augsburg, Germany.
09.30 "Early footprint estimation for area I/O packages"
Etienne Hirt, Gerhard Tröster, Electronics Lab, Zürich, Switzerland.
10.00 "Ball-Grid-Array Gehäusetechnologie" für "Multi-Chip-Module" Bericht über die Erfolge eines BMBF-Projektes anhand von Demonstratoraufbauten
Claus-Peter Czaya, Blaupunkt Werke GmbH, Hildesheim, Germany.
10.30 Coffeebreak
11.00 "A Investigation of limits of surface tension induced realignment during soldering for BGA, CSP, and flip chip packages"
Donald J. Spigarelli, SRT/Spectra, Groton, MA, USA.
11.30 "The development of a modular 32-bit microcontroller MCM in top bottom BGA (TB-BGA) technique"
Rudolf Leutenbauer, Kourosh Amiri Jam, Herbert Reichl, Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration, Berlin, Germany.
12.00 "Bilanzierung moderner Aufbau- und Verbindungstechnologien"
Marko Schwenn, Nils F. Nissen, Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration, Berlin, Germany.
SMT Produktapplikationen
Chair: Prof. Dr W. Jillek, Georg-Simon-Ohm Fachhochschule Nürnberg, Germany.
09.00 "Infrarotdetektoren in MCM-Technik"
Johann Ziegler, AEG Infrarot-Module GmbH, Heilbronn, Germany.
09.30 "Kombination von mikroelektronischen und mikrooptischen Systemkomponenten mittels moderner Aufbau-, Verbindungs- und Häusungstechnologien zur Fertigung mittlerer bis großer Stückzahlen smarter Mikrosensoren"
Ralf Röder, Wolfgang Buß, Marcus Frank, Dr Fred Grunert, MAZeT GmbH, Jena, Germany.
10.00 "Mechatronics for automotive and industrial applications"
Markos Triantafyllou, Motorola TSG, München, Germany.
10.30 Coffeebreak
11.00 "Glob Top - Passivierung"
Dipl.-Ing. Werner Schneider, Microelectronic Packaging Dresden GmbH, Dresden, Germany.
11.30 "Aspekte einer Aufbau und Verbindungstechnik für Einwegelektronik"
Karl Haberger, FhG-IFT, München, Germany.
12.00 "Umweltverträgliche Produktgestaltung und Umsetzung von Umweltrichtlinien in kleineren und mittleren Unternehmen der IKT-Branche "
M. Scheibner, imc, Berlin, Germany.
SMT - Lote und Werkstoffe
Chair: Dr E. Reese, W.C. Heraeus GmbH, Hanau, Germany.
14.00 "Solder Bumping mit Schablonendruck für Flip Chip und BGA"
P. Koskina, FhG-IZM, Berlin.
14.30 "Non-contact SMA jetting: reliability and performance enter the manufacturing environment"
M. Reighard, Nordson Corporation, Amherst, Ohio, USA.
15.00 "New anisotropically conductive materials for direct chip attach applications"
Matthew Holloway, Luana Scully, Mary Ward, Loctite, Dublin, Ireland.
15.30 Coffeebreak
16.00 "Testverfahren zur Qualifizierung der Lötbarkeit von Baugruppen unter Reflowbedingungen"
Dr-Ing. S. Wege, G. Niedermayer, Technische Universität München, Garching, Germany.
16.30 "Achieving ultra-fine dot solder paste dispensing"
Dr Ning-Cheng Lee, Indium Corporation of America, Clinton, NY, USA.
17.00 "Additive PCB's impact on the environment".
Bob Smith, Circuits Laboratory, Coates Electrographics, Bath, UK.
SMT Zukünftige Technologien
Chair: Dr L. Cergel, Motorola GmbH, Genf, Switzerland.
14.00 "SIMOV Die High Density Leiterplattentechnologie von Siemens"
Harald Metz, Siemens AG, Karlsruhe, Germany.
14.30 "Anwendungen und Technologie extrem dünner ICs"
Michael Feil, FhG-IFT, München, Germany.
15.00 "Zukunftstechnologie Der SMT Tower"
Hans-Günter Ulzhöfer, SMT Maschinen- und Vertriebs GmbH & Co. KG, Wertheim, Germany.
15.30 Coffeebreak
16.00 "Future trends in electronic subsystems"
F. Ansorge, K.-F. Becker, R. Aschenbrenner, H. Reichl, Fraunhofer IZM Institut für Zuverlässigkeit und Microintegration, Berlin, Germany.
16.30 "A new high density laminate technology for packaging of flip chip and wire-bond die"
Sundar Kamath, Gary Dudeck, MicroModule Systems, Cupertino, USA.
17.00 Microvia technologies
Jan Vardaman, TechSearch International Inc., Austin, USA.
SMT/ES&S/Hybrid Tutorials
Tutorials Tuesday 4 May 1999
Tutorial 19.00 - 17.00"Neue Aufbau- und Verbindungstechniken"Leitung: Prof. Dr W. Scheel, FhG-IZM, Berlin.
Tutorial 29.00 - 17.00"Reflow soldering and Troubleshooting for SMT, BGA, CSP and Flip Chip Processes"Dr Ning-Cheng Lee, Indium Corporation of America, USA.
Tutorial 39.00 - 12.00"Pin in hole/intrusive double sided reflow design and assembly"B. Willis, EPS.
Tutorial 49.00 - 12.00"Kleben und Löten"Leitung: A. Miric, W.C. Heraeus GmbH .
Tutorial 59.00 - 12.00"HF-gerechter Entwurf von Leiterplatten und MCM"R.O. Stahl, IBM Deutschland GmbH, BöblingenDr R. Frech, Dr H. Harrer, D. Kaller, E. Klink, T.-M. Winkel, IBM Deutschland GmbH, Böblingen.
Tutorial 69.00 - 12.00"Bestückung"Dr D. Friedrich, SMW Elektronik GmbH, Kalchreuth G. Schiebel, M. Meßmer, H. Hofmann, Siemens AG, München.
Tutorial 7 14.00 - 17.00"A-Z of ball grid array design and assembly"B. Willis, Electronic Presentation Services
Tutorial 814.00 - 17.00"Qualitätssicherung, Produktprüfung"Leitung: Dr K. Halser, Dr. B. Kämpfe, FhG-IZM, Berlin.
Tutorial 9 14.00 - 17.00"Packaging roadmap"Prof. Dr-Ing. H. Reichl, FhG-IZM, Berlin.
Tutorial 1014.00 - 17.00Fertigung von Elektronik-Baugruppen: "Prozeßanalyse unter Zuverlässigkeits- und Kostenaspekten"Dr-Ing. Gundolf Reichelt und Dipl.-Ing. Marco Kämpfert, TechnoLab GmbH Berlin.
Tutorials Thursday 6 May 1999
Tutorial 119.00 - 17.00Chip Size Packaging in der MikrosystemtechnikLeitung: Jürgen Simon, FhG-IZM, Berlin
Tutorial 129.00 - 12.00Einführung in die Zuverlässigkeit und die Physik der AusfallmechanismenMarkos Triantafyllou, Motorola GmbH, München.
Tutorial 13 9.00 - 12.00"Flip chip in produktion"Leitung: J. Kloeser, FhG-IZM, Berlin.
Tutorial 149.00 - 12.00"Steigerung der Qualität durch Prozeßfähigkeitsanalysen"Leitung: Prof. Dr Habil. W. Sauer, TU Dresden.
Tutorial 15 9.00 - 12.00"Alternative Werkstoffe"Leitung: Dr Sonja Wege, TU München.
Tutorial 169.00 - 12.00"Fine Pitch Wire Bonding - Anwendung und Einsatzgrenzen"Dr Klaus-Dieter Lang, FhG-IZM, Berlin.
Tutorial 1714.00 - 17.00Hochtemperatur Silizium System Lösungen für Autobil AnwendungenM.Triantafjllou, Motorola GmbH, München.
Tutorial 18 14.00 - 17.00Mechatronik: Kleiner - Funktioneller - IntelligenterLeitung: Dr F. Ansorge, FhG-IZM, Berlin.
Tutorial 1914.00 - 17.00"Design of PCB's as a part of an EMC adequate system development"Chair: Dipl.-Ing. W. John, FhG-IZM, Advanced System Engineering, Paderborn.
Tutorial 2014.00 - 17.00"Feuchtklimasicherheit elektronischer Baugruppen"Leitung: Dr H. Schweigart, Dr O.K.Wack Chemie GmbH.
Tutorial 2114.00 - 17.00"Rapid prototyping in der Mikroelektronik"Leitung: Dr W. Witte, Dräger Pro Tech GmbH, Lübeck.
Table I summarises the timetable of events for the SMT/ES+S/Hybrid event in May.
Table IOverview of 4-6 May
| Tuesday 4 May 1999 | Wednesday 5 May 1999 | Thursday 6 May 1999 | ||
| Tutorials | Conference session 1 | Conference session 2 | Tutorials | |
| Tutorials | Conference session 3 | Conference sesssion 4 | Tutorials | |