Thermomechanical fatigue lifetime evaluation of solder joints in power semiconductors using a novel energy based modeling
Soldering & Surface Mount Technology
ISSN: 0954-0911
Article publication date: 16 November 2020
Issue publication date: 17 May 2021
Abstract
Purpose
This paper aims to establish a more accurate model for lifetime estimation.
Design/methodology/approach
Finite element model simulation and experimental tests are used to enhance the lifetime prediction model of the solder joint.
Findings
A more precise model was found.
Originality/value
It is confirmed that the paper is original.
Keywords
Citation
Zhang, B., Jabarullah, N.H., Alkaim, A.F., Danshina, S., Krasnopevtseva, I.V., Zheng, Y. and Geetha, N. (2021), "Thermomechanical fatigue lifetime evaluation of solder joints in power semiconductors using a novel energy based modeling", Soldering & Surface Mount Technology, Vol. 33 No. 3, pp. 187-194. https://doi.org/10.1108/SSMT-06-2020-0028
Publisher
:Emerald Publishing Limited
Copyright © 2020, Emerald Publishing Limited