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Numerical modeling and optimization of fillet height of reinforced SAC305 solder joint in an ultra-fine capacitor assembly

Rilwan Kayode Apalowo (School of Mechanical Engineering, Universiti Sains Malaysia – Kampus Kejuruteraan Seri Ampangan, Nibong Tebal, Malaysia and Department of Mechanical Engineering, Federal University of Technology Akure, Akure, Nigeria)
Muhamed Abdul Fatah Muhamed Mukhtar (School of Material and Mineral Resources Engineering, Universiti Sains Malaysia – Kampus Kejuruteraan Seri Ampangan, Nibong Tebal, Malaysia)
Mohamad Aizat Abas (School of Mechanical Engineering, Universiti Sains Malaysia – Kampus Kejuruteraan Seri Ampangan, Nibong Tebal, Malaysia)
Fakhrozi Che Ani (Western Digital®, SanDisk Storage Malaysia Sdn.Bhd, Batu Kawan, Malaysia)

Soldering & Surface Mount Technology

ISSN: 0954-0911

Article publication date: 30 September 2024

Issue publication date: 11 October 2024

30

Abstract

Purpose

This study aims to investigate the design configuration for an optimum solder height of reinforced SAC305 solder joint in an ultra-fine capacitor assembly.

Design/methodology/approach

A multiphase finite volume model is developed for reflow soldering simulations to determine the fillet height of reinforced SAC305 solder joint in an ultra-fine capacitor assembly. Different solders, namely SAC305-x, SAC305-xNiO and SAC305-xTi, with varying percentage weight compositions of nanoparticles (x = 0 Wt.%, 0.01 Wt.%, 0.05 Wt.%, 0.10 Wt.%, 0.15 Wt.%) are investigated. A reflow soldering experiment is also conducted, and the cross-sections of the reflowed packages are examined using a High-Resolution Transmission Electron Microscope (HRTEM). The optimum design configurations (nanoparticle composition and material) for the solder fillet height are investigated using the Taguchi orthogonal array method.

Findings

Good correlations were recorded between the HRTEM micrographs and the numerical predictions of the nanoparticles' distribution in the molten solder. The numerical prediction of the fillet height also agrees with the experiment, with a maximum disparity of 5.43%. It was found that Ti nanoparticles, having the smallest density compared to NiO and, exhibit the highest buoyancy effect in the molten solder. The Taguchi analysis revealed that the nanoparticles' material factor is more significant than the Wt.% factor for an optimum fillet height. An optimum design configuration for fillet height was established as SAC 305–0.15 Wt.% Ti, corresponding to a 41.13% improvement of the plain SAC 305 solder.

Practical implications

The fillet height of solder joints greatly influences the solder joint reliability of miniaturized electronic packages. Solder joint reliability of ultra-fine capacitors can be improved using this study's findings on the optimum design configuration for the capacitor's solder fillet. The study’s findings can be practically implemented in industries such as electronics manufacturing, where enhanced solder joint reliability is critical.

Originality/value

Investigation of the optimum design configuration for reinforced SAC305 solder fillet is almost nonexistent in the literature. This study explored the optimization of fillet height of reinforced SAC305 solder joints in miniaturized capacitor assembly.

Keywords

Acknowledgements

This research work was supported by the following grants: Short Term Grant (Grant No.: 2024/10/I-ST66), BJIM Matching Grant (Grant No.: 1001. PMEKANIK. 8070022) and USM-WD CiA Lab Grant (Grant No.: 311/PMEKANIK/4402055).

Citation

Apalowo, R.K., Muhamed Mukhtar, M.A.F., Abas, M.A. and Che Ani, F. (2024), "Numerical modeling and optimization of fillet height of reinforced SAC305 solder joint in an ultra-fine capacitor assembly", Soldering & Surface Mount Technology, Vol. 36 No. 5, pp. 309-322. https://doi.org/10.1108/SSMT-04-2024-0020

Publisher

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Emerald Publishing Limited

Copyright © 2024, Emerald Publishing Limited

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