MEMS Mechanical Sensors

Sensor Review

ISSN: 0260-2288

Article publication date: 1 September 2004




Beeby, S.P., Ensel, G., Kraft, M. and Whita, N.M. (2004), "MEMS Mechanical Sensors", Sensor Review, Vol. 24 No. 3, pp. 319-320.



Emerald Group Publishing Limited

Copyright © 2004, Emerald Group Publishing Limited

This book provides a detailed overview of the design, simulation, and fabrication of the most common types of microeclectromechanical systems (MEMS) sensors.

Chapter 1 presents a thorough introduction to physical sensors, MEMS, the properties of silicon, and a market review of current and future demands for MEMS sensors. Materials and Fabrication Techniques, are addressed in chapter 2 and include epitaxy and oxidation; thick and thin film techniques; anodic and fusion bonding; surface micromachining; and photolithography. The following two chapters discuss Design Tool, and Packaging, respectively. Topics covered include: system level design; thermal design issues; types of standard packages; and wire bonding methods.

Chapter 5 discusses Physical Sensing Techniques, the most common being piezoresistive, piezoelectric, capacitive, optical, resonant, thermal, and magnetic. It also addresses smart sensors.

The remaining five chapters of the book present a selection of MEMS sensors, including: commercially available device, research devices, and those which may be found in the future. Chapters 6 and 7 discuss Pressure Sensors, and Flow Sensors for Microfluidics. The final chapter addresses Displacement Sensors.

“MEMS Mechanical Sensors” will be invaluable to those in academia and industry who are working with such devices. Its broad coverage makes it suitable for undergraduate and graduate students as well.

Related articles