Micromechanical sensor

Sensor Review

ISSN: 0260-2288

Article publication date: 1 March 2003

60

Keywords

Citation

Rigelsford, J. (2003), "Micromechanical sensor", Sensor Review, Vol. 23 No. 1. https://doi.org/10.1108/sr.2003.08723aad.012

Publisher

:

Emerald Group Publishing Limited

Copyright © 2003, MCB UP Limited


Micromechanical sensor

Micromechanical sensor

Applicant: Nippon Kogaku KK, USAPatent number: US6215137Publication date: 10 April 2001Title: Micromechanical sensor for scanning thermal imaging microscope and method of making the same.

Keywords: Patents, Sensors

This patent describes a method of making a micromechanical sensor for use in a scanning thermal imaging (STI) microscope. These microscopes are used for measuring temperature distribution or thermal conductivity distribution in sample surfaces, such as semiconductors.

The sensor comprises a plurality of cantilever beams extending from a substrate, where each cantilever beam has a different resonant frequency. For the desired measurement the suitable cantilever is selected, while the others are broken off and removed from the substrate.

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