Mechanical Microsensors Microtechnology and MEMS Series

Citation

Rigelsford, J. (2002), "Mechanical Microsensors Microtechnology and MEMS Series", Sensor Review, Vol. 22 No. 1. https://doi.org/10.1108/sr.2002.08722aae.001

Mechanical Microsensors Microtechnology and MEMS Series

Mechanical Microsensors Microtechnology and MEMS Series

M. Elwenspoek and R. WiegerinkSpringer2001296 pp.ISBN 3-540-67582-5£51.50 (hardback)

Keywords: Microsensors, MEMS

This book is part of the Microtechnology and MEMS series which describes the basic science, device design and applications of microsystems and microtechnology.

After and introductory chapter, chapter 2 discusses MEMS (microelectromechanical systems) and addresses subjects including: miniaturisation and systems, examples for MEMS, small and large scaling, and available fabrication technology. An Introduction to Silicon Micromachining is given in chapter 3 and discusses photolithography, thin film deposition and doping, wet chemical etching, wafer bonding, plasma etching, and surface micromachining.

Chapter 4 introduces the Mechanics of Membranes and Beams. Amongst the topics discussed are dynamics of the mass spring system, strings, beams, and diaphragms and membranes. The Principles of Measuring Mechanical Quantities: Transduction and Deformation are presented in chapter 5, and addresses metal strain gauges, semiconductor strain gauges and capacitive transducers.

The following four chapters present a range of commonly used sensors. Chapters 6 and 7 discuss Force and Pressure Sensors, and Acceleration and Rate Sensors, respectively, while Flow and Resonant Sensors are presented in chapters 8 and 9. Topics covered in these sections include: the laminar boundary layer; heat transport in the limit of very small Reynold's numbers; thermal flow sensors; skin friction; excitation and detection mechanisms; and examples and applications.

Chapter 10 discusses some of the topics associated with electronic interface design for microsensors. The chapter is divided into three parts, corresponding to the three most commonly found interface mechanisms, namely: piezoresistive, capacitive and resonant.

The final chapter of the book addresses packaging. Topics discussed include packaging techniques, stress reduction in pressure, and design considerations associated with inertial and thermal flow sensors.

"Mechanical Microsensors" provides a comprehensive description of the various design techniques required for silicon micromachining of sensors. This is a very well written book which has a pleasant balance of mathematical, physics and engineering principles, that make this book suitable for physicists, chemistry, electrical and mechanical engineers.