Dexco Polymers introduces new styrenic block copolymers for hot melt and pressure sensitive adhesive markets

Pigment & Resin Technology

ISSN: 0369-9420

Publication date: 4 July 2008

Citation

(2008), "Dexco Polymers introduces new styrenic block copolymers for hot melt and pressure sensitive adhesive markets", Pigment & Resin Technology, Vol. 37 No. 4. https://doi.org/10.1108/prt.2008.12937dad.001

Publisher

:

Emerald Group Publishing Limited

Copyright © 2008, Emerald Group Publishing Limited


Dexco Polymers introduces new styrenic block copolymers for hot melt and pressure sensitive adhesive markets

Article Type: New materials and equipment From: Pigment & Resin Technology, Volume 37, Issue 4

Dexco Polymers LP has developed styrene-isoprene-styrene (SIS) block copolymers that can be used in demanding hot melt adhesive and pressure sensitive adhesive (PSA) applications at reduced polymer loads. Vector DPX 618 and DPX 619 are new four-arm radial block copolymers that allow formulators to achieve desired adhesive performance while using less polymer in the adhesive formulations. DPX 618 is a high styrene, SIS block copolymer designed for non-woven applications, such as an elastic attachment adhesive, where high-temperature shear resistance is required. DPX 619 is a lower styrene version designed for PSA and adhesive applications that require lower shear resistance at elevated temperatures.

“Dexco Polymers has been focusing its R&D resources on inventing new polymers that offer lower cost solutions to the adhesive market,” said Chris Mudd, General Manager Dexco Polymers. “By using up to 25% less polymer for the same adhesive performance, these patented 4-arm radials offer substantial savings to the adhesive formulator.” These new products are well suited for a wide range of applications as they do not use TNPP antioxidants.

For further information, please visit the web site: www.dexcopolymers.com